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Effect of indium low doping in ZnO based TFTs on electrical parameters and bias stress stability

Journal Article · · AIP Advances
DOI:https://doi.org/10.1063/1.4935789· OSTI ID:22492181
;  [1]
  1. Physico-Technical Department, Petrozavodsk State University, Petrozavodsk 185910 (Russian Federation)
Some applications of thin film transistors (TFTs) need the bottom-gate architecture and unpassivated channel backside. We propose a simple routine to fabricate indium doped ZnO-based TFT with satisfactory characteristics and acceptable stability against a bias stress in ambient room air. To this end, a channel layer of 15 nm in thickness was deposited on cold substrate by DC reactive magnetron co-sputtering of metal Zn-In target. It is demonstrated that the increase of In concentration in ZnO matrix up to 5% leads to negative threshold voltage (V{sub T}) shift and an increase of field effect mobility (μ) and a decrease of subthreshold swing (SS). When dopant concentration reaches the upper level of 5% the best TFT parameters are achieved such as V{sub T} = 3.6 V, μ = 15.2 cm{sup 2}/V s, SS = 0.5 V/dec. The TFTs operate in enhancement mode exhibiting high turn on/turn off current ratio more than 10{sup 6}. It is shown that the oxidative post-fabrication annealing at 250{sup o}C in pure oxygen and next ageing in dry air for several hours provide highly stable operational characteristics under negative and positive bias stresses despite open channel backside. A possible cause of this effect is discussed.
OSTI ID:
22492181
Journal Information:
AIP Advances, Journal Name: AIP Advances Journal Issue: 11 Vol. 5; ISSN AAIDBI; ISSN 2158-3226
Country of Publication:
United States
Language:
English

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