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Study of microstructure and electrical properties of bulk YBCO prepared by melt textured growth technique

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.4918175· OSTI ID:22490570
;  [1];  [2];  [3]; ;  [4]
  1. Glass and Advanced Materials Division, Bhabha Atomic Research Centre, Mumbai, INDIA 400 085 (India)
  2. Materials Science Division, Bhabha Atomic Research Centre, Mumbai, INDIA 400 085 (India)
  3. Chemistry Division, Bhabha Atomic Research Centre, Mumbai, INDIA 400 085 (India)
  4. Department of Electric Power Engineering, Budapest Univ. of Technology & Economics, Budapest (Hungary)
Bulk YBCO components were prepared using Melt Texture Growth (MTG) technique. Components were fabricated using MTG by addition of Y{sub 2}BaCuO{sub 5} (Y211) and Ag to YBCO, which leads to improved grain size without affecting superconducting properties. Green compacts prepared by cold isostatic pressing were pre-sintered at 930°C before subjecting melt texturing. Cooling rates lower than 1 °C.h{sup −1} was used, in between (peritectic) temperature of about 995 and 1025°C, to obtain large grained components. Microstructure studies in details were carried out by Scanning Electron Microscope (SEM), Electron Probe Micro Analysis (EPMA), Orientation Imaging Microscope (OIM) and TEM correlated with electrical properties like Critical current density (J{sub c})
OSTI ID:
22490570
Journal Information:
AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 1665; ISSN APCPCS; ISSN 0094-243X
Country of Publication:
United States
Language:
English

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