Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates

Nizolek, Thomas; Avallone, Jaclyn T.; Pollock, Tresa M.; Beyerlein, Irene J.; Mara, Nathan A.

doi:10.1063/1.4941043

Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates

Journal Article · Mon Feb 01 04:00:00 EST 2016 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4941043· OSTI ID:22489400

Nizolek, Thomas; Avallone, Jaclyn T.; Pollock, Tresa M. ^[1]; Beyerlein, Irene J. ^[2]; Mara, Nathan A. ^[3]

Materials Department, University of California Santa Barbara, Santa Barbara, California 93106 (United States)
Theoretical Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
Institute for Materials Science and the Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)

The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses.

OSTI ID:: 22489400

Journal Information:: Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 5 Vol. 108; ISSN APPLAB; ISSN 0003-6951

Country of Publication:: United States

Language:: English

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