Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution

Journal Article · Fri Sep 25 00:00:00 EDT 2015 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4931260· OSTI ID:22488971

Sarveswaran, C.; Othman, N. K. ^[1]; Ali, M. Yusuf Tura; Ani, F. Che; Samsudin, Z. ^[2]

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1. School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor (Malaysia)
2. Jabil Circuit Sdn Bhd, Bayan Lepas Industrial Park, 11900, Penang (Malaysia)

Current issue in lead-free solder in term of its reliability is still under investigation. This high impact research attempts to investigate the electrochemical migration (ECM) on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy by Water Drop Test (WDT) in different concentration of HNO{sub 3} solution. The concentration of HNO{sub 3} solution used in this research was 0.05, 0.10, 0.50 and 1M. Optical Microscope (OM), Field Emission Scanning Electron Microscope (FESEM) and Energy Dispersive X-Ray Analysis (EDX) were carried out in order to analysis the ECM behavior based on the growth of dendrite formation after WDT. In general, the results demonstrated that dendrite growth is faster in higher concentration compared with low concentration of HNO{sub 3}. The concentration of HNO{sub 3} solution used has a strong correlation with Mean-Time-To-Failure (MTTF). As the concentration of HNO{sub 3} increases, the MTTF value decreases. Based on the MTTF results the solder alloy in 1M HNO{sub 3} solution is most susceptible to ECM. SnO{sub 2} forms as a corrosion by-product in the samples proved by EDX analysis. The solder alloy poses a high reliability risk in microelectronic devices during operation in 1M HNO{sub 3} solution.

• OSTI ID: 22488971
• Journal Information: AIP Conference Proceedings, Vol. 1678, Issue 1; Conference: Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2015 Postgraduate Colloquium, Selangor (Malaysia), 15-16 Apr 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ABUNDANCE
COMPARATIVE EVALUATIONS
CONCENTRATION RATIO
COPPER ALLOYS
CORROSION
DENDRITES
ELECTROCHEMISTRY
FIELD EMISSION
NICKEL ADDITIONS
NITRIC ACID
PHOSPHORUS ADDITIONS
RELIABILITY
SCANNING ELECTRON MICROSCOPY
SILVER ALLOYS
SOLUTIONS
TIN ALLOYS
TIN OXIDES
WATER
X-RAY SPECTROSCOPY