First-principles study on the effect of SiO{sub 2} layers during oxidation of 4H-SiC
- Center for Computational Sciences, University of Tsukuba, Tsukuba, Ibaraki 305-8577 (Japan)
- Graduate School of Engineering, Osaka University, Suita, Osaka 565-0871 (Japan)
The effect of SiO{sub 2} layers during the thermal oxidation of a 4H-SiC(0001) substrate is examined by performing the first-principles total-energy calculations. Although it is expected that a CO molecule is the most preferable product during the oxidation, CO{sub 2} molecules are mainly emitted from the SiC surface at the initial stage of the oxidation. As the oxidation proceeds, CO{sub 2} emission becomes less favorable and CO molecules are emitted from the interface. We conclude that the interface stress due to the lattice constant mismatch between 4H-SiC(0001) and SiO{sub 2} is responsible for the removal of C during the oxidation, resulting in the characteristic electronic property of the interface fabricated by the thermal oxidation.
- OSTI ID:
- 22412683
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 8 Vol. 106; ISSN APPLAB; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Passivation of Oxide Layers on 4H-SiC Using Sequential Anneals in Nitric Oxide and Hydrogen
Fabrication of SiO{sub 2}/4H-SiC (0001) interface with nearly ideal capacitance-voltage characteristics by thermal oxidation
Cathodoluminescence study of radiative interface defects in thermally grown SiO{sub 2}/4H-SiC(0001) structures
Conference
·
Wed Dec 31 23:00:00 EST 2003
·
OSTI ID:978128
Fabrication of SiO{sub 2}/4H-SiC (0001) interface with nearly ideal capacitance-voltage characteristics by thermal oxidation
Journal Article
·
Mon Jul 21 00:00:00 EDT 2014
· Applied Physics Letters
·
OSTI ID:22311142
Cathodoluminescence study of radiative interface defects in thermally grown SiO{sub 2}/4H-SiC(0001) structures
Journal Article
·
Mon Jun 29 00:00:00 EDT 2015
· Applied Physics Letters
·
OSTI ID:22483114