An investigation on microstructure evolution and mechanical properties during liquid state diffusion bonding of Al2024 to Ti–6Al–4V
- Department of Materials Engineering, Tehran Science and Research Branch, Islamic Azad University, Tehran (Iran, Islamic Republic of)
- School of Metallurgy and Materials Engineering, College of Engineering, University of Tehran, Tehran (Iran, Islamic Republic of)
Joining mechanism of Ti/Al dissimilar alloys was studied during liquid state diffusion bonding process using Cu/Sn/Cu interlayer at 510 °C under vacuum of 7.5 × 10{sup −5} Torr for various bonding times. The microstructure and compositional changes in the joint zone were analyzed by scanning electron microscopy equipped with energy dispersive spectroscopy and X-ray diffraction. Microhardness and shear strength tests were also applied to study the mechanical properties of the joints. It was found that with an increase in bonding time, the elements of interlayer diffused into the parent metals and formed various intermetallic compounds at the interface. Diffusion process led to the isothermal solidification and the bonding evolution in the joint zone. The results from mechanical tests showed that microhardness and shear strength values have a straight relation with bonding time so that the maximum shear strength of joint was obtained for a bond made with 60 min bonding time. - Highlights: • Liquid state diffusion bonding of Al2024 to Ti–6Al–4V was performed successfully. • Diffusion of the elements caused the formation of various intermetallics at the interface. • Microhardness and shear strength values have a straight relation with bonding time. • The maximum shear strength reached to 36 MPa in 60 min bonding time.
- OSTI ID:
- 22403605
- Journal Information:
- Materials Characterization, Vol. 98; Other Information: Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM BASE ALLOYS
BONDING
DIFFUSION
INTERFACES
INTERMETALLIC COMPOUNDS
LIQUIDS
MECHANICAL TESTS
MICROHARDNESS
MICROSTRUCTURE
SCANNING ELECTRON MICROSCOPY
SHEAR PROPERTIES
SOLIDIFICATION
TEMPERATURE DEPENDENCE
TITANIUM ALLOYS
VANADIUM ALLOYS
X-RAY DIFFRACTION
X-RAY SPECTROSCOPY