The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys
- Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)
- Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, PO Box 6122, 13083-970 Campinas, SP (Brazil)
Bi–Ag alloys have been stressed as possible alternatives to replace Pb-based solder alloys. Although acceptable melting temperatures and suitable mechanical properties may characterize such alloys, as referenced in literature, there is a lack of comprehension regarding their microstructures (morphologies and sizes of the phases) considering a composition range from 1.5 to 4.0 wt.%Ag. In order to better comprehend such aspects and their correlations with solidification thermal parameters (growth rate, v and cooling rate, T-dot), directional solidification experiments were carried out under transient heat flow conditions. The effects of Ag content on both cooling rate and growth rate during solidification are examined. Microstructure parameters such as eutectic/dendritic spacing, interphase spacing and diameter of the Ag-rich phase were determined by optical microscopy and scanning electron microscopy. The competition between eutectic cells and dendrites in the range from 1.5 to 4.0 wt.%Ag is explained by the coupled zone concept. Microhardness was determined for different microstructures and alloy Ag contents with a view to permitting correlations with microstructure parameters to be established. Hardness is shown to be directly affected by both solute macrosegregation and morphologies of the phases forming the Bi–Ag alloys, with higher hardness being associated with the cellular morphology of the Bi-2.5 and 4.0 wt.%Ag alloys. - Highlights: • Asymmetric zone of coupled growth for Bi–Ag is demonstrated. • Faceted Bi-rich dendrites have been characterized for Bi–1.5 wt.%Ag alloy. • Eutectic cells were shown for the Bi-2.5 and 4.0 wt.%Ag solder alloys. • Interphase spacing relations with G × v are able to represent the experimental scatters. • Hall-Petch type equations are proposed relating microstructural spacings to hardness.
- OSTI ID:
- 22403567
- Journal Information:
- Materials Characterization, Journal Name: Materials Characterization Vol. 96; ISSN 1044-5803; ISSN MACHEX
- Country of Publication:
- United States
- Language:
- English
Similar Records
Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
Microstructural formation in a hypereutectic Mg-Si alloy