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Title: Strain characterization of fin-shaped field effect transistors with SiGe stressors using nanobeam electron diffraction

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4893926· OSTI ID:22310967
; ; ; ;  [1];  [2]
  1. Department of Materials Science and Engineering, Yonsei University, Seoul 120-749 (Korea, Republic of)
  2. Department of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746 (Korea, Republic of)

This study undertook strain analysis on fin-shaped field effect transistor structures with epitaxial Si{sub 1−x}Ge{sub x} stressors, using nano-beam electron diffraction and finite elements method. Combining the two methods disclosed dynamic strain distribution in the source/drain and channel region of the fin structure, and the effects of dimensional factors such as the stressor thickness and fin width, offering valuable information for device design.

OSTI ID:
22310967
Journal Information:
Applied Physics Letters, Vol. 105, Issue 8; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English

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