Thermal Design Consideration of Medium Voltage High Frequency Transformers

Conference · Sun Mar 01 04:00:00 EST 2020 · 2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

DOI:https://doi.org/10.1109/apec39645.2020.9124264· OSTI ID:2229094

Wang, Haoming ^[1]; Guo, Zhichen; Tayebi, S. Milad; Zhao, Xin; Huang, Qingyun; Yu, Ruiyang; Yang, Qingxin; Li, Yongjian; Huang, Alex Q.

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1. University of Texas at Austin

This paper describes a thermal design using epoxy potting for high frequency transformer (HFT) for medium voltage high power electronic applications, namely emerging solid-state transformers. To address HFT’s thermal stress problem, thermal performance of the HFT with air and epoxy potting cooling method are both simulated by magnetothermal-fluid coupling method (MTFCM). The effectiveness of the simulation analysis is verified in a 100 kW DC-DC resonant converter. Influencing factors including distance between the high frequency transformer and the metal enclosure, epoxy thermal conductivity and heat sink placements are simulated and analyzed. Finally, an optimal cooling structure is proposed for future high power HFTs.

• Research Organization: University of Texas at Austin
• Sponsoring Organization: USDOE Office of Energy Efficiency and Renewable Energy (EERE)
• DOE Contract Number: EE0008348
• OSTI ID: 2229094
• Conference Information: Journal Name: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC)
• Country of Publication: United States
• Language: English