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Dielectric strength of voidless BaTiO{sub 3} films with nano-scale grains fabricated by aerosol deposition

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4851675· OSTI ID:22271293
;  [1];  [1]; ;  [2];  [3];  [4]
  1. Department of Electronics Materials Engineering, Kwangwoon University, Seoul (Korea, Republic of)
  2. Department of Nano and Electronic Physics, Kookmin University, Seoul (Korea, Republic of)
  3. R and D Center, Samwha Capacitor, Yongin (Korea, Republic of)
  4. Department of Ceramic Engineering, Engineering Research Institute, Gyeongsang National University, Jinju (Korea, Republic of)
In order to investigate the dielectric strength properties of the BaTiO{sub 3} films with nano-scale grains with uniform grain size and no voids, BaTiO{sub 3} films were fabricated with a thickness of 1 μm by an AD process, and the fabricated films were sintered at 800, 900, and 1000 °C in air and reducing atmosphere. The films have superior dielectric strength properties due to their uniform grain size and high density without any voids. In addition, based on investigation of the leakage current (intrinsic) properties, it was confirmed that the sintering conditions of the reducing atmosphere largely increase leakage currents due to generated electrons and doubly ionized oxygen vacancies following the Poole-Frenkel emission mechanism, and increased leakage currents flow at grain boundary regions. Therefore, we conclude that the extrinsic breakdown factors should be eliminated for superior dielectric strength properties, and it is important to enhance grain boundaries by doping acceptors and rare-earth elements.
OSTI ID:
22271293
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 1 Vol. 115; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English