Radiative thermal rectification using superconducting materials
- Institut Pprime, Université de Poitiers-CNRS-ENSMA, 2, Rue Pierre Brousse, Bâtiment B25, TSA 41105, 86073 Poitiers Cedex 9 (France)
Thermal rectification can be defined as an asymmetry in the heat flux when the temperature difference between two interacting thermal reservoirs is reversed. In this Letter, we present a far-field radiative thermal rectifier based on high-temperature superconducting materials with a rectification ratio up to 80%. This value is among the highest reported in literature. Two configurations are examined: a superconductor (Tl{sub 2}Ba{sub 2}CaCu{sub 2}O{sub 8}) exchanging heat with (1) a black body and (2) another superconductor, YBa{sub 2}Cu{sub 3}O{sub 7} in this case. The first configuration shows a higher maximal rectification ratio. Besides, we show that the two-superconductor rectifier exhibits different rectification regimes depending on the choice of the reference temperature, i.e., the temperature of the thermostat. Presented results might be useful for energy conversion devices, efficient cryogenic radiative insulators engineering, and thermal logical circuits’ development.
- OSTI ID:
- 22257065
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 10 Vol. 104; ISSN APPLAB; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Positron annihilation in high-T/sub c/ superconductors
Scaling behavior of fluctuation conductivity of high-temperature superconductors in a magnetic field
Stability of Tl-Ba-Ca-Cu-O superconducting thin films
Journal Article
·
Mon May 01 00:00:00 EDT 1989
· Phys. Rev. B: Condens. Matter; (United States)
·
OSTI ID:6114459
Scaling behavior of fluctuation conductivity of high-temperature superconductors in a magnetic field
Journal Article
·
Fri May 01 00:00:00 EDT 1992
· Physical Review, B: Condensed Matter; (United States)
·
OSTI ID:7043264
Stability of Tl-Ba-Ca-Cu-O superconducting thin films
Journal Article
·
Tue Nov 30 23:00:00 EST 1999
· Journal of Materials Research
·
OSTI ID:20215441