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Full Control and Manipulation of Heat Signatures: Cloaking, Camouflage and Thermal Metamaterials
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journal
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February 2014 |
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Oxide dispersion strengthened 304 L stainless steel produced by ink jetting and laser powder bed fusion
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journal
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January 2020 |
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Selective interfacial bonding in Al(Si)–diamond composites and its effect on thermal conductivity
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journal
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December 2006 |
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Effect of flow maldistribution and axial conduction on compact microchannel heat exchanger
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journal
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March 2014 |
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A new structural model of effective thermal conductivity for heterogeneous materials with co-continuous phases
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journal
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May 2008 |
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Thermal stability of additively manufactured austenitic 304L ODS alloy
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journal
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August 2021 |
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Interfacial characterization of SLM parts in multi-material processing: Metallurgical diffusion between 316L stainless steel and C18400 copper alloy
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journal
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August 2014 |
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Selective laser melting of an oxide dispersion strengthened (ODS) γ-TiAl alloy towards production of complex structures
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journal
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November 2017 |
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Correlation between process parameters, microstructure and properties of 316 L stainless steel processed by selective laser melting
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journal
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March 2018 |
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Microstructure and mechanical properties of stainless steel 316L vertical struts manufactured by laser powder bed fusion process
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journal
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October 2018 |
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Selective laser melting of austenitic oxide dispersion strengthened steel: Processing, microstructural evolution and strengthening mechanisms
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journal
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June 2020 |
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Enhanced thermal conductivity in diamond/aluminum composites: Comparison between the methods of adding Ti into Al matrix and coating Ti onto diamond surface
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journal
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February 2013 |
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Thermal conductivity of tungsten–copper composites
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journal
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August 2012 |
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Synergetic Effect of Blended Alkylamines for Copper Complex Ink To Form Conductive Copper Films
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journal
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December 2016 |
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A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics
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journal
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February 2014 |
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Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics
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journal
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January 2015 |
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Metal particle-free inks for printed flexible electronics
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journal
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January 2019 |
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Chemical vapor deposition of copper from Cu+1 precursors in the presence of water vapor
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journal
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November 1993 |
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Patterned low temperature copper-rich deposits using inkjet printing
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journal
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December 2002 |
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Heat flux cloaking, focusing, and reversal in ultra-thin composites considering conduction-convection effects
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journal
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August 2013 |
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Copper-based alloys for structural high-heat-flux applications: a review of development, properties, and performance of Cu-rich Cu–Cr–Nb alloys
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journal
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October 2020 |
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Effect of Anisotropy in Permeability and Effective Thermal Conductivity on Thermal Performance of an Aluminum foam heat sink
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journal
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July 2001 |
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Heat transport across a SiGe nanowire axial junction: Interface thermal resistance and thermal rectification
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journal
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July 2014 |
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Heat Flux Manipulation with Engineered Thermal Materials
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journal
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May 2012 |
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Ultrathin Three-Dimensional Thermal Cloak
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journal
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February 2014 |
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Experimental Demonstration of a Bilayer Thermal Cloak
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journal
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February 2014 |
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Temperature-Dependent Transformation Thermotics: From Switchable Thermal Cloaks to Macroscopic Thermal Diodes
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journal
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November 2015 |
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Surface-Selective Chemical Vapor Deposition of Copper Films through the Use of a Molecular Inhibitor
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journal
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January 2015 |
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Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites
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journal
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December 2015 |
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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics
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journal
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August 2020 |