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Epitaxial (111) films of Cu, Ni, and Cu{sub x}Ni{sub y} on {alpha}-Al{sub 2}O{sub 3} (0001) for graphene growth by chemical vapor deposition

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4754013· OSTI ID:22089462
; ; ; ;  [1]
  1. National Institute of Standards and Technology, Boulder, Colorado 80305 (United States)
Films of (111)-textured Cu, Ni, and Cu{sub x}Ni{sub y} were evaluated as substrates for chemical vapor deposition of graphene. A metal thickness of 400 nm to 700 nm was sputtered onto a substrate of {alpha}-Al{sub 2}O{sub 3}(0001) at temperatures of 250 Degree-Sign C to 650 Degree-Sign C. The films were then annealed at 1000 Degree-Sign C in a tube furnace. X-ray and electron backscatter diffraction measurements showed all films have (111) texture but have grains with in-plane orientations differing by 60 Degree-Sign . The in-plane epitaxial relationship for all films was [110]{sub metal}||[1010]{sub Al{sub 2O{sub 3}}}. Reactive sputtering of Al in O{sub 2} before metal deposition resulted in a single in-plane orientation over 97% of the Ni film but had no significant effect on the Cu grain structure. Transmission electron microscopy showed a clean Ni/Al{sub 2}O{sub 3} interface, confirmed the epitaxial relationship, and showed that formation of the 60 Degree-Sign twin grains was associated with features on the Al{sub 2}O{sub 3} surface. Increasing total pressure and Cu vapor pressure during annealing decreased the roughness of Cu and Cu{sub x}Ni{sub y} films. Graphene grown on the Ni(111) films was more uniform than that grown on polycrystalline Ni/SiO{sub 2} films, but still showed thickness variations on a much smaller length scale than the distance between grains.
OSTI ID:
22089462
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 6 Vol. 112; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English