Fabrication of high aspect grating using bonded substrate for X-ray refraction imaging by Talbot-Lau interferometer

Journal Article · Tue Jul 31 04:00:00 EDT 2012 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4742289· OSTI ID:22069164

Tada, Takuji; Murakoshi, Dai; Ishii, Hiroyasu; Hashimoto, Atsushi; Kaneko, Yasuhisa; Ito, Wataru; Agano, Toshitaka ^[1]

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1. Medical Systems Research and Development Center, R and D Management Headquarters, FUJIFILM Corp., 798, Miyanodai, Kaisei-machi, Ashigarakami-gun, Kanagawa 258-8538 (Japan)

In order to improve the image quality of X-ray refraction images using a Talbot-Lau interferometer, we have been attempting to fabricate gratings with high aspect ratio. In our attempt, deep grooves of grating structure were channeled on a Si substrate bonded by Au diffusion bonding method, and the grooves were filled with Au where the Au layer used for the bonding Si substrate was acting as a seed layer of Au electroplating. From the results of a visibility measurement and a cross sectional SEM image, it was confirmed that the grooves with a pitch of 5.8 {mu}m and a depth of 100 {mu}m could be successfully filled with Au over a large area of 72 Multiplication-Sign 80 mm{sup 2}. Using this grating, the X-ray refraction images for the cartilage of a knee joint of a livestock pig could be obtained where SPS method was employed for the single-shot image acquisition.

• OSTI ID: 22069164
• Journal Information: AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 1466; ISSN APCPCS; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ASPECT RATIO
BONDING
BONE JOINTS
CARTILAGE
DIFFRACTION GRATINGS
DIFFUSION
ELECTROPLATING
GOLD
IMAGES
INTERFEROMETERS
LAYERS
SCANNING ELECTRON MICROSCOPY
SILICON
SUBSTRATES
SWINE
VISIBILITY
X RADIATION