Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders
Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on the titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.
- OSTI ID:
- 22066454
- Journal Information:
- Materials Characterization, Vol. 68, Issue Complete; Other Information: Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
Similar Records
Properties of ternary Sn-Ag-Bi solder alloys. Part 2: Wettability and mechanical properties analyses
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints
Related Subjects
ALUMINIUM ALLOYS
ALUMINIUM OXIDES
BONDING
CHEMICAL COMPOSITION
INTERFACES
MATERIALS TESTING
MELTING
MICROSTRUCTURE
OPTICAL MICROSCOPY
SCANNING ELECTRON MICROSCOPY
SHEAR
SHEAR PROPERTIES
SILVER ALLOYS
SOLDERING
THERMAL CONDUCTION
TIN ALLOYS
TITANIUM
TITANIUM ALLOYS
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION