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Dislocation engineering in SiGe heteroepitaxial films on patterned Si (001) substrates

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.3569145· OSTI ID:21518335
; ; ;  [1]; ; ; ; ; ;  [2]
  1. L-NESS and Dipartimento di Scienza dei Materiali, Universita degli Studi di Milano-Bicocca, via R. Cozzi 53, I-20125 Milano (Italy)
  2. Institut fuer Halbleiter- und Festkoerperphysik, Johannes Kepler Universitaet, Altenberger Str. 69, A-4040 Linz (Austria)
We demonstrate dislocation engineering without oxide masks. By using finite element simulations we show how nanopatterning of Si substrates with (111) trenches provides anisotropic elastic relaxation in a SiGe film, generates preferential nucleation sites for dislocation loops, and allows for dislocation trapping, leaving wide areas free of threading dislocations. These predictions are confirmed by atomic force and transmission electron microscopy performed on overcritical Si{sub 0.7}Ge{sub 0.3} films. These were grown by molecular beam epitaxy on a Si(001) substrate patterned with periodic arrays of selectively etched (111)-terminated trenches.
OSTI ID:
21518335
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 12 Vol. 98; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English