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Title: Performing in-feed type centerless grinding process on a surface grinder

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.3552581· OSTI ID:21510206
 [1]; ; ;  [2]
  1. Graduate School, Akita Prefectural University, 84-4 Tsuchiya-ebinokuchi, Yirihonjo, Akita 015-0055 (Japan)
  2. Dept. of Machine Intelligence and Systems Engineering, Akita Prefectural University, 84-4 Tsuchiya-ebinokuchi, Yurihonjo, Akita 015-0055 (Japan)

In our previous study, a new centerless grinding method using surface grinder was proposed. In this method, centerless grinding operations are performed by installing a compact centerless grinding unit, consisting mainly of an ultrasonic elliptic-vibration shoe, a blade and their respective holders, on the worktable of a surface grinder. During grinding, the cylindrical workpiece is held on the ultrasonic shoe and the blade, and its rotational motion is controlled by the elliptic motion of the shoe end-face. An actual unit had been produced and its performance in tangential-feed type centerless grinding using a surface grinder had been confirmed in the previous workd. In this paper, the performance of the grinding unit in in-feed centerless grinding operation was confirmed, and the effects of the main process parameter, i.e., eccentric angle, on the workpiece roundness was investigated experimentally. The obtained results showed that: (1) the centerless grinding unit performed well in in-feed type centerless grinding; (2) the eccentric angle affects roundness significantly, and its optimal angle is 6 deg.; (3) the workpiece roundness can be further improved by varying the eccentric angle during grinding, and the final roundness reached 0.65 {mu}m after grinding as the eccentric angle varied from 9 deg. to 6 deg. and to 3 deg.

OSTI ID:
21510206
Journal Information:
AIP Conference Proceedings, Vol. 1315, Issue 1; Conference: AMPT2010: International conference on advances in materials and processing technologies, Paris (France), 24-27 Oct 2010; Other Information: DOI: 10.1063/1.3552581; (c) 2010 American Institute of Physics; ISSN 0094-243X
Country of Publication:
United States
Language:
English