PROCESSING OF HIGH-PERFORMANCE Nb{sub 3}Sn WIRES THROUGH A NEW DIFFUSION REACTION USING Sn BASED ALLOYS

Journal Article · Thu Apr 08 00:00:00 EDT 2010 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3402297· OSTI ID:21371740

Tachikawa, K; Sasaki, H; Yamaguchi, M; Hayashi, Y; Nakata, K ^[1]; Takeuchi, T ^[2]

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1. Faculty of Engineering, Tokai University, Hiratsuka, Kanagawa 259-1292 (Japan)
2. National Institute for Materials Science, Tsukuba, Ibaraki 305-0047 (Japan)

Tightly consolidated Sn-Ta and Sn-B based alloys have been prepared by the reaction among constituent metal powders at 750-775 deg. C. Sn-Ta and Sn-B based alloys exhibit quite similar microstructures. A small amount of Ti addition seems to improve the bonding between Ta or B particles and Sn matrix. Nb{sub 3}Sn wires have been fabricated by the Jelly Roll (JR) and Multi-rod (MR) process using Sn based alloy sheet and rod, respectively. Thick Nb{sub 3}Sn layers with nearly stoichiometric A15 composition are synthesized through a new diffusion mechanism between Nb and Sn based alloy. B{sub c2}(4.2 K)'s of 26.9 T (mid) and 26.5 T (mid) have been obtained in the JR and MR processed wires, respectively, using Sn-Ta based alloy. These wires exhibit enough non-Cu J{sub c} to be used above 20 T and 4.2 K. T{sub c} of JR wires using Sn-B based sheet is 18.14 K (offset) which is slightly higher than that of wires using Sn-Ta based sheet.

• OSTI ID: 21371740
• Journal Information: AIP Conference Proceedings, Vol. 1219, Issue 1; Conference: International cryogenic materials conference (ICMC) on advances in cryogenic engineering materials, Tucson, AZ (United States), 28 Jun - 2 Jul 2009; Other Information: DOI: 10.1063/1.3402297; (c) 2010 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BONDING
BORON
COMPOSITE MATERIALS
CRITICAL CURRENT
CRITICAL FIELD
CURRENT DENSITY
DIFFUSION
INTERMETALLIC COMPOUNDS
LAYERS
MICROSTRUCTURE
NIOBIUM
PERFORMANCE
POWDERS
SCANNING ELECTRON MICROSCOPY
SUPERCONDUCTING WIRES
TANTALUM
TEMPERATURE RANGE 0000-0013 K
TIN
TYPE-I SUPERCONDUCTORS
ALLOYS
CURRENTS
ELECTRIC CURRENTS
ELECTRON MICROSCOPY
ELEMENTS
FABRICATION
JOINING
MAGNETIC FIELDS
MATERIALS
METALS
MICROSCOPY
REFRACTORY METALS
SEMIMETALS
SUPERCONDUCTORS
TEMPERATURE RANGE
TRANSITION ELEMENTS
WIRES