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Microcrystalline Si films grown at low temperatures (90-220 deg. C) with high rates in atmospheric-pressure VHF plasma

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.3159887· OSTI ID:21359286
; ; ; ;  [1]
  1. Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871 (Japan)

This work deals with the structural properties of microcrystalline silicon (muc-Si:H) films grown at low temperatures (90-220 deg. C) with high rates in atmospheric-pressure He/H{sub 2}/SiH{sub 4} plasma, which is excited by a 150 MHz very high frequency power using a porous carbon electrode. This plasma permits to enhance the chemical reactions both in gas phase and on the film-growing surface, while suppressing ion impingement upon the surface. Raman crystalline volume fractions of the muc-Si:H films are studied in detail as functions of film thickness and substrate temperature (T{sub sub}). The results show that the muc-Si:H film deposited with 50 (SCCM) (SCCM denotes standard cubic centimeters per minute at STP) SiH{sub 4} has no amorphous transition layers at the film/substrate interface in spite of the high deposition rate of 6.4 nm/s, which is verified by the cross sectional observations with a transmission electron microscope. In addition, the T{sub sub} dependence of Raman crystallinity of the muc-Si:H films indicates that a highly crystallized muc-Si:H film grows even when T{sub sub} is reduced to 90 deg. C. Further systematic studies are needed for both device applications and deposition on thermally sensitive plastic materials.

OSTI ID:
21359286
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 1 Vol. 106; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English