Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron-Based Technique for In Situ Characterization
- Laboratory for Nanometallurgy, Department of Materials, ETH Zurich, Wolfgang-Pauli-Str. 10, CH-8093 Zurich (Switzerland)
- Department of Polymer Engineering, Faculty of Engineering Science, University of Bayreuth, Universitaetsstrasse 30, D-95447 Bayreuth (Germany)
In situ synchrotron radiation diffraction and confocal light microscopy is used to study fragmentation and buckling of thin brittle Ta layers with thicknesses of 50 nm, 100 nm and 200 nm on polyimide substrates. Synchrotron-based stress measurements confirm that cracking leads to relaxation of tensile stress. Simultaneously, compressive stress arises in transverse direction, which finally leads to buckling. This behavior can be explained quantitatively by a two-dimensional shear lag model. It is well established that the properties of the coating-substrate interface determine the processes of coating fragmentation and delamination. A possible approach for influencing and controlling these processes is given by the incorporation of a ductile interlayer. It can be observed that the presence of Cu interlayers with thicknesses of 5 nm, 20 nm and 50 nm reduces the fracture strength of brittle Ta coatings on polyimide substrates, whereas the resistance to buckling is increased significantly.
- OSTI ID:
- 21316800
- Journal Information:
- AIP Conference Proceedings, Vol. 1143, Issue 1; Conference: 10. international workshop on stress-induced phenomena in metallization, Austin, TX (United States), 5-7 Nov 2008; Other Information: DOI: 10.1063/1.3169250; (c) 2009 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
- Country of Publication:
- United States
- Language:
- English
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