SiO{sub x} layer formation during plasma sputtering of Si and SiO{sub 2} targets
- Novosibirsk State University (Russian Federation)
- Russian Academy of Sciences, Institute of Semiconductor Physics, Siberian Branch (Russian Federation)
- Hebrew University, Racah Institute of Physics (Israel)
Deposition of SiO{sub x} layers of variable composition onto silicon wafers was performed by co-sputtering of spaced Si and SiO{sub 2} targets in argon plasma. Coordinate dependences of the thickness and refractive index of separately deposited Si and SiO{sub 2} layers and the SiO{sub x} layer grown during co-sputtering of targets were determined using optical techniques. It was shown that the SiO{sub x} layer composition is not equal to a simple sum of thicknesses of separately deposited Si and SiO{sub 2} layers. The coordinate dependences of the Si and SiO{sub 2} layer thicknesses were calculated. To fit the calculated and experimental data, it is necessary to assume that no less than 10% of silicon is converted to dioxide during co-sputtering. A comparison of the coordinate dependences of the IR absorbance in SiO{sub 2} and SiO{sub x} layers with experimental ellipsometric data confirmed the presence of excess oxygen in the SiO{sub x} layer. Taking into account such partial oxidation of sputtered silicon, composition isolines in the substrate plane were calculated. After annealing of the SiO{sub x} layer at 1200{sup o}C, photoluminescence was observed in a wafer area predicted by calculations, which was caused by the formation of quantum-size Si nanocrystallites. The photoluminescence intensity was maximum at x = 1.78 {+-} 0.3, which is close to the composition optimum for ion-beam synthesis of nanocrystals.
- OSTI ID:
- 21255656
- Journal Information:
- Semiconductors, Journal Name: Semiconductors Journal Issue: 6 Vol. 42; ISSN SMICES; ISSN 1063-7826
- Country of Publication:
- United States
- Language:
- English
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