Wafer heating mechanisms in a molecular gas, inductively coupled plasma: in situ, real time wafer surface measurements and three-dimensional thermal modeling
- Department of Chemical Engineering, University of California, Berkeley, California 94720 (United States)
The authors report measurements and modeling of wafer heating mechanisms in an Ar/O{sub 2} inductively coupled plasma (ICP). The authors employed a commercially available on-wafer sensor system (PlasmaTemp developed by KLA-Tencor) consisting of an on-board electronics module housing battery power and data storage with 30 temperature sensors embedded onto the wafer at different radial positions. This system allows for real time, in situ wafer temperature measurements. Wafer heating mechanisms were investigated by combining temperature measurements from the PlasmaTemp sensor wafer with a three-dimensional heat transfer model of the wafer and a model of the ICP. Comparisons between pure Ar and Ar/O{sub 2} discharges demonstrated that two additional wafer heating mechanisms can be important in molecular gas plasmas compared to atomic gas discharges. The two mechanisms are heating from the gas phase and O-atom surface recombination. These mechanisms were shown to contribute as much as 60% to wafer heating under conditions of low bias power. This study demonstrated how the 'on-wafer' temperature sensor not only yields a temperature profile distribution across the wafer, but can be used to help determine plasma characteristics, such as ion flux profiles or plasma processing temperatures.
- OSTI ID:
- 21192413
- Journal Information:
- Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, Vol. 26, Issue 5; Other Information: DOI: 10.1116/1.2953713; (c) 2008 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1553-1813
- Country of Publication:
- United States
- Language:
- English
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