Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
- Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan (China)
Polyethylene glycol (PEG) is an additive that is commonly used as a suppressor in the semiconductor copper (Cu)-electroplating process. In this study, electrochemical impedance spectroscopy (EIS) was used to analyze the electrochemical behavior of PEG in the Cu-electroplating process. Polarization analysis, cyclic-voltammetry stripping, and cell voltage versus plating time were examined to clarify the suppression behavior of PEG. The equivalent circuit simulated from the EIS data shows that PEG inhibited the Cu-electroplating rate by increasing the charge-transfer resistance as well as the resistance of the adsorption layer. The presence of a large inductance demonstrated the strong adsorption of cuprous-PEG-chloride complexes on the Cu surface during the Cu-electroplating process. Increasing the PEG concentration appears to increase the resistances of charge transfer, the adsorption layer, and the inductance of the electroplating system.
- OSTI ID:
- 21192408
- Journal Information:
- Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, Vol. 26, Issue 5; Other Information: DOI: 10.1116/1.2949233; (c) 2008 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1553-1813
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
ORGANIC
PHYSICAL AND ANALYTICAL CHEMISTRY
ADSORPTION
CHARGE EXCHANGE
CHEMICAL ANALYSIS
CHLORIDES
COPPER
ELECTROCHEMISTRY
ELECTROPLATING
EQUIVALENT CIRCUITS
IMPEDANCE
INDUCTANCE
INHIBITION
INTEGRATED CIRCUITS
LAYERS
POLYETHYLENE GLYCOLS
SEMICONDUCTOR MATERIALS
SPECTROSCOPY
STRIPPING
VOLTAMETRY