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Title: Tin laser-produced plasma source modeling at 13.5 nm for extreme ultraviolet lithography

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.2906901· OSTI ID:21101986
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  1. School of Physics, University College Dublin, Belfield, Dublin 4 (Ireland)
  2. EPPRA SAS, Villebon sur Yvette 91140 (France)
  3. Keldysh Institute of Applied Mathematics RAS, Moscow 125047 (Russian Federation)
  4. Institute of Laser Engineering, Osaka University, 2-6 Yamada-Oka, Suita, Osaka 565-0871 (Japan)

Extreme ultraviolet lithography semiconductor manufacturing requires a 13.5 nm light source. Laser-produced plasma emission from Sn V-Sn XIV ions is one proposed industry solution. The effect of laser pulse width and spatial profile on conversion efficiency is analyzed over a range of power densities using a two-dimensional radiative magnetohydrodynamic code and compared to experiment using a 1.064 {mu}m, neodymium:yttrium aluminium garnet laser on a planar tin target. The calculated and experimental conversion efficiencies and the effects of self-absorption in the plasma edge are compared. Best agreement between theory and experiment is found for an 8.0 ns Gaussian pulse.

OSTI ID:
21101986
Journal Information:
Applied Physics Letters, Vol. 92, Issue 15; Other Information: DOI: 10.1063/1.2906901; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English