Mechanical characterization of solution-derived nanoparticle silver ink thin films
- Palo Alto Research Center (PARC), 3333 Coyote Hill Road, Palo Alto, California 94304 (United States)
Mechanical properties of sintered silver nanoparticles are investigated via substrate curvature and nanoindentation methods. Substrate curvature measurements reveal that permanent microstructural changes occur during initial heating while subsequent annealing results in nearly elastic behavior of the thinner films. Thicker films were found to crack upon thermal treatment. The coefficient of thermal expansion was determined from linear slopes of curvature curves to be 1.9{+-}0.097 ppm/ degree sign C, with elastic modulus and hardness determined via nanoindentation. Accounting for substrate effects, nanoindentation hardness and modulus remained constant for different film thicknesses and did not appear to be a function of annealing conditions. Hardness of 0.91 GPa and modulus of 110 GPa are somewhat lower than expected for a continuous nanocrystalline silver film, most likely due to porosity.
- OSTI ID:
- 20982891
- Journal Information:
- Journal of Applied Physics, Vol. 101, Issue 10; Other Information: DOI: 10.1063/1.2735404; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
Similar Records
Critical issues in measuring the mechanical properties of hard films on soft substrates by nanoindentation techniques
Mechanical characterization of Lipon films using nanoindentation