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Title: Low temperature magnetron sputter deposition of polycrystalline silicon thin films using high flux ion bombardment

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.2710301· OSTI ID:20982754
;  [1]
  1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green Street, Urbana, Illinois 61801 (United States)

We demonstrate that the microstructure of polycrystalline silicon thin films depends strongly on the flux of low energy ions that bombard the growth surface during magnetron sputter deposition. The deposition system is equipped with external electromagnetic coils which, through the unbalanced magnetron effect, provide direct control of the ion flux independent of the ion energy. We report the influence of low energy (<27 eV) Ar{sup +} on the low temperature (<450 degree sign C) growth of polycrystalline silicon thin films onto amorphous substrates. We use spectroscopic ellipsometry, Raman scattering, x-ray diffraction, and cross sectional transmission electron microscopy to analyze the film microstructure. We demonstrate that increasing the flux ratio of Ar{sup +} ions to silicon neutrals (J{sup +}/J{sup 0}) during growth by an order of magnitude (from 3 to 30) enables the direct nucleation of polycrystalline Si on glass and SiO{sub 2} coated Si at temperatures below 400 degree sign C. We discuss possible mechanisms for this enhancement of crystalline microstructure, including the roles of enhanced adatom mobility and the formation of shallow, mobile defects.

OSTI ID:
20982754
Journal Information:
Journal of Applied Physics, Vol. 101, Issue 6; Other Information: DOI: 10.1063/1.2710301; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English