Time resolved x-ray reflectivity study of interfacial reactions in Cu/Mg thin films during heat treatment
- Grup de Fisica de Materials I, Dept. Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain)
We present an in-situ time-resolved synchrotron x-ray reflectivity (XRR) analysis of the thermal stability of Cu/Mg/Cu trilayers during heating ramps up to 300 deg. C at 2 deg. C/min. We demonstrate that under some simplifying assumptions the temporal evolution of XRR scans can be used to follow the kinetics of formation of the CuMg{sub 2} intermetallic phase. The simultaneous refinement of selected parameters of 70 reflectivity scans measured during the heat treatment permits an accurate analysis with respect to the as-deposited state. A gradual damping of the long period Kiessig fringes of the trilayer structure is observed upon heating up to 190 deg. C. Above this temperature the XRR is reminiscent of a single thin film of CuMg{sub 2}. The evolution of interface interdiffusion and/or roughness and thickness of the initial layers allowed to identify a differentiated nucleation and lateral growth process of the intermetallic CuMg{sub 2} phase depending on the type of interface, Cu on Mg and Mg on Cu. These results are compared to experimental measurements obtained from differential scanning calorimetry.
- OSTI ID:
- 20976704
- Journal Information:
- Physical Review. B, Condensed Matter and Materials Physics, Vol. 75, Issue 7; Other Information: DOI: 10.1103/PhysRevB.75.075419; (c) 2007 The American Physical Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1098-0121
- Country of Publication:
- United States
- Language:
- English
Similar Records
Aging behavior of an in-situ TiB{sub 2}/Al-Cu-Li-x matrix composite
Mechanical behavior and texture development of over-aged and solution treated Al-Cu-Mg alloy during multi-directional forging