High performance hard magnetic NdFeB thick films for integration into micro-electro-mechanical systems

Journal Article · Mon Feb 26 00:00:00 EST 2007 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.2710771· OSTI ID:20971858

Dempsey, N M; Walther, A; May, F; Givord, D; Khlopkov, K; Gutfleisch, O ^[1]

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1. Institut Neel, CNRS-UJF, 25 rue. des Martyrs, 38042 Grenoble (France)

5 {mu}m thick NdFeB films have been sputtered onto 100 mm Si substrates using high rate sputtering (18 {mu}m/h). Films were deposited at {<=}500 deg. C and then annealed at 750 deg. C for 10 min. While films deposited at temperatures up to 450 deg. C have equiaxed grains, the size of which decreases with increasing deposition temperature, the films deposited at 500 deg. C have columnar grains. The out-of-plane remanent magnetization increases with deposition temperature, reaching a maximum value of 1.4 T, while the coercivity remains constant at about 1.6 T. The maximum energy product achieved (400 kJ/m{sup 3}) is comparable to that of high-quality NdFeB sintered magnets.

• OSTI ID: 20971858
• Journal Information: Applied Physics Letters, Vol. 90, Issue 9; Other Information: DOI: 10.1063/1.2710771; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ANNEALING
BORON ALLOYS
COERCIVE FORCE
GRAIN SIZE
IRON ALLOYS
MAGNETIZATION
NEODYMIUM ALLOYS
PERMANENT MAGNETS
SILICON
SPUTTERING
SUBSTRATES
SURFACE COATING
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0400-1000 K
TEMPERATURE RANGE 1000-4000 K
THIN FILMS
TIME DEPENDENCE