Characterization of Vacancy Defects in Electroplated Cu Films by Positron Annihilation and its Impact on Stress Migration Reliability

Journal Article · Tue Feb 07 00:00:00 EST 2006 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.2173550· OSTI ID:20798178

Suzuki, T; Nakamura, T; Mizushima, Y ^[1]; Kouno, T ^[2]; Uedono, A ^[3]; Tsuchikawa, H ^[1]

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1. Fujitsu Laboratories LTD. Akiruno Technology Center 50 Fuchigami, Akiruno, Tokyo, 197-0833 (Japan)
2. Fujitsu LTD. Akiruno Technology Center 50 Fuchigami, Akiruno, Tokyo, 197-0833 (Japan)
3. Institute of Applied Physics, University of Tsukuba, Tsukuba, Ibaraki 305-8573 (Japan)

Positron annihilation was used to evaluate vacancy concentrations in electroplated Cu films with different kinds of electrolytes. The influence of various electrolytes on the impurities, grain boundaries, and micro-voids were also investigated. We found a higher impurity concentration and larger micro-voids were observed in copper films with higher vacancy concentrations. We reduced the failure rate in our stress migration results using a copper film with a higher concentration of vacancy and impurity. The stress migration performance improved because impurity nucleated vacancy clusters act as effective traps for diffusing vacancies.

• OSTI ID: 20798178
• Journal Information: AIP Conference Proceedings, Vol. 817, Issue 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173550; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ANNIHILATION
COPPER
CRYSTALS
ELECTROLYTES
ELECTROPLATING
FILMS
GRAIN BOUNDARIES
IMPURITIES
PERFORMANCE
POSITRONS
RELIABILITY
STRESSES
TRAPS
VACANCIES
VOIDS