Stress-induced wrinkling of sputtered SiO{sub 2} films on polymethylmethacrylate

Journal Article · Wed Mar 15 00:00:00 EST 2006 · Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films

DOI:https://doi.org/10.1116/1.2171711· OSTI ID:20777049

Serrano, Justin R; Qinqin, Xu; Cahill, David G ^[1]

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1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (United States)

Compressively stressed SiO{sub 2} films are deposited by rf magnetron sputtering onto polymethylmethacrylate- (PMMA) coated Si substrates. The oxide film roughens by wrinkling during deposition; wrinkling is enabled by the viscous flow of the PMMA layer. The nanoscale lateral length scale of the wrinkling, {approx}120 nm, is established during the first few nanometers of film deposition and is controlled by the thickness and stress of the SiO{sub 2} film at the onset of the instability. Continued deposition of SiO{sub 2} leads to a rapid increase and then saturation of the rms roughness at {approx}5 nm.

• OSTI ID: 20777049
• Journal Information: Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, Vol. 24, Issue 2; Other Information: DOI: 10.1116/1.2171711; (c) 2006 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1553-1813
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
DEPOSITION
LENGTH
MAGNETRONS
NANOSTRUCTURES
PMMA
ROUGHNESS
SILICA
SILICON OXIDES
SPUTTERING
STRESSES
SUBSTRATES
SURFACES
THICKNESS
THIN FILMS
VISCOUS FLOW