The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder

Journal Article · Tue Mar 15 00:00:00 EST 2005 · Materials Characterization

DOI:https://doi.org/10.1016/j.matchar.2004.11.013· OSTI ID:20748742

Fengqun, Lang ^[1]; Tanaka, Hiroyuki ^[2]; Munegata, Osamu ^[3]; Taguchi, Toshihiko ^[3]; Narita, Toshio ^[1]

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1. Research Group of Interface Control Engineering, Graduate School of Engineering, Hokkaido University, Kita-Ku Kita-13 Nishi-8, Sapporo 060-8628 (Japan)
2. Hokkaido Industrial Research Institute, Sapporo 060-0819 (Japan)
3. Senju Metal Industry Co. Ltd., Sokashi 340-0023 (Japan)

The tensile response of Sn-3.5% Ag solder was investigated and compared with that of a Sn-37% Pb eutectic solder at various strain rates from 2.38x10{sup -6} s{sup -1} to 2.38x10{sup -3} s{sup -1} over the temperature range from -50 deg. C to 150 deg. C. The relationship between tensile strength, {sigma} {sub UTS}, and strain rate, {epsilon}', for Sn-3.5Ag can be expressed by the equation {sigma} {sub UTS}=A{epsilon}' {sup m}. The influence of temperature on the strain rate sensitivity index m was very slight for Sn-3.5Ag, whereas the m values of Sn-37Pb increased strongly with increasing temperature. The relationship between the tensile strength of the Sn-3.5Ag alloy and temperature follows an Arrhenius law, and the activation energy for creep was found to be 78 kJ/mol, close to that for the pipe diffusion controlled creep of tin. The microstructure and fracture morphologies of both solders were observed with a scanning electron microscope. Ag{sub 3}Sn particles were observed in the primary {beta}-Sn in the Sn-3.5Ag solder by transmission electron microscope.

• OSTI ID: 20748742
• Journal Information: Materials Characterization, Vol. 54, Issue 3; Other Information: DOI: 10.1016/j.matchar.2004.11.013; PII: S1044-5803(04)00280-3; Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ACTIVATION ENERGY
ALLOYS
CREEP
DIFFUSION
EUTECTICS
FRACTURES
MICROSTRUCTURE
MORPHOLOGY
PARTICLES
SCANNING ELECTRON MICROSCOPY
SENSITIVITY
STRAIN RATE
SULFUR IONS
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0065-0273 K
TEMPERATURE RANGE 0273-0400 K
TENSILE PROPERTIES
TIN
TRANSMISSION ELECTRON MICROSCOPY