Surface Wave Metrology for Copper/Low-k Interconnects
Journal Article
·
· AIP Conference Proceedings
- Philips Advanced Metrology Systems, 12 Michigan Drive, Natick, MA 01760 (United States)
We review recent advances in the application of laser-induced surface acoustic wave metrology to issues in copper/low-k interconnect development and manufacturing. We illustrate how the metrology technique can be used to measure copper thickness uniformity on a range of features from solid pads to arrays of lines, focusing on specific processing issues in copper electrochemical deposition (ECD) and chemical-mechanical polishing (CMP). In addition, we review recent developments in surface wave metrology for the characterization of low-k dielectric elastic modulus, including the ability to measure within-wafer uniformity of elastic modulus and to characterize porous, anisotropic films.
- OSTI ID:
- 20719271
- Journal Information:
- AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 788; ISSN 0094-243X; ISSN APCPCS
- Country of Publication:
- United States
- Language:
- English
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