Threshold current density of electromigration in eutectic SnPb solder
- Department of Material Science and Engineering, National Chiao Tung University, Hsin-chu 300, Taiwan (China)
Electromigration has emerged as an important reliability issue in the microelectronics packaging industry since the dimension of solder joints has continued to shrink. In this letter, we report a technique that enables the precise measurement of the important parameters of solder electromigration, such as activation energy, critical length, threshold current density, effective charge numbers, and electromigration rate. Patterned Cu/Ti films in a Si trench were employed for eutectic SnPb solder to be reflowed on, and thus solder Blech specimens were fabricated. Atomic force microscope was used to measure the depletion volume caused by electromigration on the cathode end. The threshold current density is estimated to be 8.5x10{sup 3} A/cm{sup 2} at 100 deg. C, which relates directly to the maximum allowable current that a solder joint can carry without electromigration damage. This technique facilitates the scientifically systematic investigation of electromigration in solders.
- OSTI ID:
- 20702359
- Journal Information:
- Applied Physics Letters, Vol. 86, Issue 20; Other Information: DOI: 10.1063/1.1929870; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits
In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction