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Title: Texture formation in FePt thin films via thermal stress management

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1924889· OSTI ID:20702335
; ;  [1]
  1. Department of Mechanical Engineering and Center for Materials Research and Analysis, University of Nebraska-Lincoln, N104WSEC, P. O. Box 880656, Lincoln, Nebraska 68512 (United States)

The transformation variant of the fcc to fct transformation in FePt thin films was tailored by controlling the stresses in the thin films, thereby allowing selection of in- or out-of-plane c-axis orientation. FePt thin films were deposited at ambient temperature on several substrates with differing coefficients of thermal expansion relative to the FePt, which generated thermal stresses during the ordering heat treatment. X-ray diffraction analysis revealed preferential out-of-plane c-axis orientation for FePt films deposited on substrates with a similar coefficients of thermal expansion, and random orientation for FePt films deposited on substrates with a very low coefficient of thermal expansion, which is consistent with theoretical analysis when considering residual stresses.

OSTI ID:
20702335
Journal Information:
Applied Physics Letters, Vol. 86, Issue 19; Other Information: DOI: 10.1063/1.1924889; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English