High resolution, high speed ultrahigh vacuum microscopy
- National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, California 94720 (United States)
The history and future of transmission electron microscopy (TEM) is discussed as it refers to the eventual development of instruments and techniques applicable to the real time in situ investigation of surface processes with high resolution. To reach this objective, it was necessary to transform conventional high resolution instruments so that an ultrahigh vacuum (UHV) environment at the sample site was created, that access to the sample by various in situ sample modification procedures was provided, and that in situ sample exchanges with other integrated surface analytical systems became possible. Furthermore, high resolution image acquisition systems had to be developed to take advantage of the high speed imaging capabilities of projection imaging microscopes. These changes to conventional electron microscopy and its uses were slowly realized in a few international laboratories over a period of almost 40 years by a relatively small number of researchers crucially interested in advancing the state of the art of electron microscopy and its applications to diverse areas of interest; often concentrating on the nucleation, growth, and properties of thin films on well defined material surfaces. A part of this review is dedicated to the recognition of the major contributions to surface and thin film science by these pioneers. Finally, some of the important current developments in aberration corrected electron optics and eventual adaptations to in situ UHV microscopy are discussed. As a result of all the path breaking developments that have led to today's highly sophisticated UHV-TEM systems, integrated fundamental studies are now possible that combine many traditional surface science approaches. Combined investigations to date have involved in situ and ex situ surface microscopies such as scanning tunneling microscopy/atomic force microscopy, scanning Auger microscopy, and photoemission electron microscopy, and area-integrating techniques such as x-ray photoelectron spectroscopy, ultraviolet photoelectron spectroscopy, Auger electron spectroscopy, low-energy electron diffraction, temperature programmed desorption, high-resolution electron energy-loss and Fourier-transform infrared spectroscopies, and others. Material systems ranging from atomic layers of metals and semiconductors to biology related depositions are being investigated. In the case of biological materials, however, strict limitations to high-resolution applications are imposed by electron radiation damage considerations.
- OSTI ID:
- 20636559
- Journal Information:
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Vol. 22, Issue 5; Other Information: DOI: 10.1116/1.1786304; (c) 2004 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 0734-2101
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
ATOMIC FORCE MICROSCOPY
AUGER ELECTRON SPECTROSCOPY
CRYSTAL GROWTH
ELECTRON DIFFRACTION
ELECTRON MICROSCOPES
FOURIER TRANSFORM SPECTROMETERS
NUCLEATION
PHOTOEMISSION
PRESSURE RANGE BELOW 1 NANO PA
RESOLUTION
SCANNING TUNNELING MICROSCOPY
SEMICONDUCTOR MATERIALS
SURFACE COATING
SURFACE PROPERTIES
THIN FILMS
TRANSMISSION ELECTRON MICROSCOPY
ULTRAVIOLET RADIATION
X-RAY PHOTOELECTRON SPECTROSCOPY