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Title: Deposition of Ti{sub 2}AlC and Ti{sub 3}AlC{sub 2} epitaxial films by magnetron sputtering

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1780597· OSTI ID:20632711
; ; ;  [1]
  1. Department of Materials Chemistry, Angstroem Laboratory, Uppsala University, P.O. Box 538, S-751 21 Uppsala (Sweden)

Thin films of the M{sub n+1}AX{sub n}-phases Ti{sub 2}AlC and Ti{sub 3}AlC{sub 2} have been deposited by dc magnetron sputtering. In agreement with the Ti-Si-C system, the MAX-phase nucleation is strongly temperature dependent. At 900 deg. C epitaxial films of Ti{sub 2}AlC and Ti{sub 3}AlC{sub 2} were grown, but at 700 deg. C only a cubic (Ti,Al)C phase was formed. In addition, a perovskite carbide, Ti{sub 3}AlC was grown at 800 deg. C. A bulk resistivity of 0.51 {mu}{omega} m, 0.44 {mu}{omega} m, and 1.4 {mu}{omega} m was measured for the Ti{sub 3}AlC{sub 2}, Ti{sub 2}AlC, and Ti{sub 3}AlC films deposited at 900 deg. C, respectively. By nanoindentation the hardness and Young's module was determined for an epitaxial Ti{sub 3}AlC{sub 2} film to 20 GPa and 260 GPa, respectively.

OSTI ID:
20632711
Journal Information:
Applied Physics Letters, Vol. 85, Issue 6; Other Information: DOI: 10.1063/1.1780597; (c) 2004 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English