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Integrated amorphous and polycrystalline silicon TFTs with a single silicon layer

Conference ·
OSTI ID:20107963

Selective exposure of an a-Si:H film to a room temperature hydrogen plasma using a patterned SiN{sub x} capping layer and a subsequent anneal at 600 C, resulted in polycrystalline and amorphous silicon regions in a single silicon layer on the same glass substrate. Top-gate non-self-aligned TFTs were fabricated in both the amorphous and polycrystalline regions with all shared processing steps and no laser processing using a re-hydrogenation step. The TFTs had good characteristics, with field-effect mobilities up to 1.2 cm{sup 2}/Vs and 15 cm{sup 2}/Vs for the a-Si:H and the poly-Si TFTs, respectively, and ON/OFF ratios > 10{sup 5} in either case.

Research Organization:
Princeton Univ., NJ (US)
Sponsoring Organization:
Defense Advanced Research Project Agency; US Department of Energy
DOE Contract Number:
AC02-76CH03073
OSTI ID:
20107963
Country of Publication:
United States
Language:
English