Effects of grain boundary on slip morphology and dislocation patterns in a fatigued copper bicrystal

Journal Article · Fri May 21 04:00:00 EDT 1999 · Scripta Materialia

DOI:https://doi.org/10.1016/S1359-6462(99)00122-0· OSTI ID:20023095

Zhang, Z F; Wang, Z G; Hu, Y M

By TEM technique, the fatigued dislocation structure in copper single crystals have been extensively investigated. Recently, the electron channeling contrast (ECC) technique in SEM has been widely applied to study the dislocation patterns in deformed metals, such as nickel, copper, aluminum and stainless steel. In particular, the SEM-ECC technique has many attractive features, for example, studying the dislocation arrangements over a large area and at some special sites of the specimen, including the vicinity of GBs, deformation bands and cracks. To clarify the GB effect, bicrystal should be regarded as a very ideal model material. In their previous work, the interactions of PSBs with large- and low-angle GBs in copper bicrystal and multicrystal have been investigated. Wherein, the GB was perpendicular to the stress axis and secondary slip was not activated during cyclic deformation of the copper bicrystal. Therefore, the interaction of PSB with GB was relatively simple. Whereas, for the copper bicrystals with a parallel GB, the plastic strain incompatibility was rather serious and secondary slip or multiple slip was often activated near the GB, leading to a GB affected zone (GBAZ) during cycle deformation. In this paper, the effect of GB on slip morphology and dislocation pattern will be further investigated in a fatigued [{bar 1}24]/[{bar 1}27] copper bicrystal with the help of the SEM-ECC technique.

• Research Organization: Inst. of Meal Research, Shenyang (CN)
• OSTI ID: 20023095
• Journal Information: Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: 12 Vol. 40; ISSN 1359-6462; ISSN SCMAF7
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BICRYSTALS
COPPER
DEFORMATION
DISLOCATIONS
FATIGUE
MICROSTRUCTURE
MORPHOLOGY
SCANNING ELECTRON MICROSCOPY
SLIP