Method of monolithic module assembly

Patent · Tue Oct 26 00:00:00 EDT 1999

OSTI ID:20014140

Gee, J M; Garrett, S E; Morgan, W P; Worobey, W

Methods for monolithic module assembly which translate many of the advantages of monolithic module construction of thin-film PV modules to wafered c-Si PV modules. Methods employ using back-contact solar cells positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The methods of the invention allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 20014140
• Resource Relation: Other Information: PBD: 26 Oct 1999
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
SILICON SOLAR CELLS
FABRICATION
THIN FILMS
BACK CONTACT SOLAR CELLS
SOLAR CELL ARRAYS