Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly
Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example, thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy's defects of harmful reactivity along with substrate metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker.
- Research Organization:
- Furukawa Electric Co., Ltd., Nikko (JP)
- OSTI ID:
- 20001750
- Journal Information:
- Journal of Electronic Materials, Vol. 28, Issue 11; Conference: InterconnectPACK: Interconnections for Electronic Packaging, San Diego, CA (US), 02/28/1999--03/04/1999; Other Information: PBD: Nov 1999
- Country of Publication:
- United States
- Language:
- English
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