Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements
Solidification of eutectic Sn-Ag solder, with and without Cu{sub 6}Sn{sub 5} composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientation, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu{sub 6}Sn{sub 5} particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to solder joints with more load carrying area.
- Research Organization:
- Michigan State Univ., East Lansing, MI (US)
- OSTI ID:
- 20001749
- Journal Information:
- Journal of Electronic Materials, Journal Name: Journal of Electronic Materials Journal Issue: 11 Vol. 28; ISSN JECMA5
- Country of Publication:
- United States
- Language:
- English
Similar Records
Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique
Solderability of AZ31B Magnesium Alloy Coated by Copper and Strength of the Solder Joints