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Title: Mechanical fatigue of thin copper foil

Journal Article · · Journal of Electronic Materials

The electrodeposited and the rolled 12 to 35 {micro}m thick copper foils are subjected to the bending/unbending strain-controlled flex fatigue over a wide range of strain amplitudes. The fatigue life is associated with an increase in electrical resistance of the specimen beyond a preassigned threshold. For each foil type, in the rolled or as-deposited as well as in the (recrystallization-like) annealed conditions, the inverse Coffin-Manson (C-M) relationship between strain amplitude ({Delta}{epsilon}/2) and fatigue life (N{sub f}) is established in the high {Delta}{epsilon}/2 (low N{sub f}) and the low {Delta}{epsilon}/2 (high N{sub f}) regimes. The N{sub f}, {Delta}{epsilon}/2, and C-M slopes (c,b) are utilized to calculate the cyclic strain hardening (n{prime}) and fatigue ductility (D{sub f}) parameters. It is shown that for a given foil thickness, an universal relationship exists between D{sub f} and the strength ({sigma}) normalized fatigue life (N{sub f}/{sigma}). The propagation of fatigue crack through the foil thickness and across the sample width is related to the unique fine grain structure for each foil type: pancaked grains for the rolled foil and equiaxed grains for the electrodeposited foil. The fatal failure corresponds to convergence of the through-thickness and the across-the-width fatigue cracks. The variations in (i) electrical resistance, (ii) mid-thickness microhardness and grain structure and (iii) dislocation configurations with fatigue are monitored. Except for a small but significant fatigue induced softening (or hardening), nonconvincing evidence of strain localization (and the associated dislocation configurations generally observed for the bulk samples) has been found.

Research Organization:
Gould Electronics, Eastlake, OH (US)
OSTI ID:
20000141
Journal Information:
Journal of Electronic Materials, Vol. 28, Issue 9; Conference: 1999 TMS Annual Meeting, San Diego, CA (US), 03/02/1999--03/03/1999; Other Information: PBD: Sep 1999; ISSN 0361-5235
Country of Publication:
United States
Language:
English

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