Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications

Nocheseda, Carla Joyce C.; Ballesteros, Laureen Ida M.; Grande, Marianna Lourdes; Caldona, Eugene B.; Advincula, Rigoberto C.

doi:10.1016/j.matchemphys.2023.128193

Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications

Journal Article · Thu Jul 20 00:00:00 EDT 2023 · Materials Chemistry and Physics

DOI:https://doi.org/10.1016/j.matchemphys.2023.128193· OSTI ID:1999018

^[1]; ^[2]; ^[3]; ^[4]; Advincula, Rigoberto C. ^[5]

Metals Industry Research and Development Center (Philippines); Univ. of Tennessee, Knoxville, TN (United States); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
Metals Industry Research and Development Center (Philippines)
Philippines Nuclear Research Institute (Philipines)
North Dakota State Univ., Fargo, ND (United States)
Univ. of Tennessee, Knoxville, TN (United States); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS); Case Western Reserve Univ., Cleveland, OH (United States)

Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.

View Accepted Manuscript (DOE)

Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities (SUF)

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1999018

Alternate ID(s):: OSTI ID: 1999848

Journal Information:: Materials Chemistry and Physics, Journal Name: Materials Chemistry and Physics Vol. 308; ISSN 0254-0584

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications

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