Surface Preparation of Metallic Substrates for Quality SRF Thin Films

Conference · Fri Jun 01 04:00:00 EDT 2012

OSTI ID:1994826

Spradlin, Joshua; Valente, Anne-Marie; Trofimova, Olga

Surface Preparation of Metallic Substrates for Quality SRF Thin Films J. Spradlin*, A.-M. Valente-Feliciano, O. Trofimova, Thomas Jefferson National Accelerator Facility, Newport News, VA U.S.A. Surface preparation is an essential prerequisite for thin film depositions. Rough or chemically impure surfaces adversely affect the nature of the thin film. Understanding the properties of the substrate and how they influence the quality of the thin film is necessary to transfer thin film deposition technologies to SRF cavity applications. A substrate that is flat, has sufficient grain size, and is chemically pure is the ideal starting point for thin film depositions. A method for copper substrate preparation is reviewed for niobium thin film deposition that provides epitaxy on large and fine grain copper as well as single crystal copper. Preliminary data on niobium and aluminum substrate preparation will also be included. *Authored by Jefferson Science Associates, LLC under U.S. DOE Contract No. DE-AC05-06OR23177.

• Research Organization: Thomas Jefferson National Accelerator Facility, Newport News, VA (United States)
• Sponsoring Organization: USDOE Office of Science (SC), Nuclear Physics (NP)
• DOE Contract Number: AC05-06OR23177
• OSTI ID: 1994826
• Report Number(s): JLAB-ACC-11-1527; DOE/OR/23177-6948
• Country of Publication: United States
• Language: English