Stretchable and Self‐Healable Semiconductive Composites Based on Hydrogen Bonding Cross‐linked Elastomeric Matrix

Wang, Yunfei; Chen, Kai‐Lin; Prine, Nathaniel; Rondeau‐Gagné, Simon; Chiu, Yu‐Cheng; Gu, Xiaodan

doi:10.1002/adfm.202303031

Title: Stretchable and Self‐Healable Semiconductive Composites Based on Hydrogen Bonding Cross‐linked Elastomeric Matrix

Journal Article · Tue Jun 20 00:00:00 EDT 2023 · Advanced Functional Materials

DOI:https://doi.org/10.1002/adfm.202303031· OSTI ID:1986095

^[1]; Chen, Kai‐Lin ^[2]; Prine, Nathaniel ^[1]; Rondeau‐Gagné, Simon ^[3]; Chiu, Yu‐Cheng ^[2];

^[1]

School of Polymer Science and Engineering Center for Optoelectronic Materials and Devices The University of Southern Mississippi Hattiesburg MS 39406 USA
Department of Chemical Engineering National Taiwan University of Science and Technology Taipei 106 Taiwan
Department of Chemistry and Biochemistry University of Windsor Windsor ON N9B3P4 Canada

Abstract Semiconductors with both high stretchability and self‐healing capability are highly desirable for various wearable devices. Much progress has been achieved in designing highly stretchable semiconductive polymers or composites. The demonstration of self‐healable semiconductive composite is still rare. Here, an extremely soft, highly stretchable, and self‐healable hydrogen bonding cross‐linked elastomer, amide functionalized‐polyisobutylene (PIB‐amide) is developed, to enable a self‐healable semiconductive composite through compounding with a high‐performance conjugated diketopyrrolopyrrole (DPP‐T) polymer. The composite, consisting of 20% DPP‐T and 80% PIB‐amide, shows record high crack‐onset strain (COS ≈1500%), extremely low elastic modulus (E≈1.6 MPa), and unique ability to spontaneously self‐heal atroom temperature within 5 min. Unlike previous works, these unique composite materials also show strain‐independent charge mobility. An in‐depth morphological study based on multi‐model techniques indicate that all composites show blending ratio‐ and stretching‐independent fibril‐like aggregation due to the strong hydrogen bond in elastomer to enable the unique stable charge mobility. This study provides a new direction to develop highly healable and electronically stable semiconductive composite and will enable new applications of stretchable electronics.

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Sponsoring Organization:: USDOE

Grant/Contract Number:: DE‐AC02‐05CH11231

OSTI ID:: 1986095

Journal Information:: Advanced Functional Materials, Journal Name: Advanced Functional Materials Vol. 33 Journal Issue: 42; ISSN 1616-301X

Publisher:: Wiley Blackwell (John Wiley & Sons)Copyright Statement

Country of Publication:: Germany

Language:: English

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