Design and Assembly of a Large-Aperture Nb3Sn Cos-Theta Dipole Coil With Stress Management in Dipole Mirror Configuration

Novitski, Igor; Zlobin, Alexander V.; Barzi, Emanuela; Turrioni, Daniele

doi:10.1109/tasc.2023.3244894

Design and Assembly of a Large-Aperture Nb₃Sn Cos-Theta Dipole Coil With Stress Management in Dipole Mirror Configuration

Journal Article · Wed Mar 01 00:00:00 UTC 2023 · IEEE Transactions on Applied Superconductivity

DOI:https://doi.org/10.1109/tasc.2023.3244894· OSTI ID:1971805

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Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)

The stress-management cos-theta (SMCT) coil is a new concept which has been proposed and is being developed at Fermilab in the framework of US Magnet Development Program (US-MDP) for high-field and/or large-aperture accelerator magnets based on low-temperature and high-temperature superconductors. The SMCT structure is used to reduce large coil deformations under the Lorentz forces and, thus, the excessively large strains and stresses in the coil. A large-aperture Nb₃ Sn SMCT dipole coil has been developed and fabricated at Fermilab to demonstrate and test the SMCT concept including coil design, fabrication technology and performance. The first SMCT coil has been assembled with 60-mm aperture Nb₃ Sn coil inside a dipole mirror configuration and will be tested separately and in series with the insert coil. Here this paper summarizes the large-aperture SMCT coil design and parameters and reports the coil fabrication steps and its assembly in dipole mirror configuration.

View Accepted Manuscript (DOE)

Research Organization:: Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), High Energy Physics (HEP)

Grant/Contract Number:: AC02-07CH11359

OSTI ID:: 1971805

Report Number(s):: FERMILAB-CONF-23-074-TD; arXiv:2304.13155; oai:inspirehep.net:2652556

Journal Information:: IEEE Transactions on Applied Superconductivity, Journal Name: IEEE Transactions on Applied Superconductivity Journal Issue: 5 Vol. 33; ISSN 1051-8223

Publisher:: IEEECopyright Statement

Country of Publication:: United States

Language:: English

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