U.S. Department of EnergyOffice of Scientific and Technical Information
Enhancing thermal conductivity of fluids with nanoparticles
You are accessing a document from the Department of Energy's (DOE) OSTI.GOV.
This site is a product of DOE's Office of Scientific and Technical Information (OSTI) and is provided as a public service.
Visit OSTI to utilize additional information resources in energy science and technology.
Abstract
Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.
- Authors:
- Publication Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 196525
- Report Number(s):
- ANL/MSD/CP-84938; CONF-951135-29
ON: DE96004174; TRN: 96:001707
- DOE Contract Number:
- W-31109-ENG-38
- Resource Type:
- Conference
- Resource Relation:
- Conference: 1995 International mechanical engineering congress and exhibition, San Francisco, CA (United States), 12-17 Nov 1995; Other Information: PBD: Oct 1995
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; HEAT TRANSFER FLUIDS; THERMAL CONDUCTIVITY; COPPER; FRICTION; PRESSURE DROP; REYNOLDS NUMBER; SUSPENSIONS
Citation Formats
Choi, S U.S., and Eastman, J A. Enhancing thermal conductivity of fluids with nanoparticles. United States: N. p., 1995.
Web.
Choi, S U.S., & Eastman, J A. Enhancing thermal conductivity of fluids with nanoparticles. United States.
Choi, S U.S., and Eastman, J A. 1995.
"Enhancing thermal conductivity of fluids with nanoparticles". United States. https://www.osti.gov/servlets/purl/196525.
@article{osti_196525,
title = {Enhancing thermal conductivity of fluids with nanoparticles},
author = {Choi, S U.S. and Eastman, J A},
abstractNote = {Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.},
doi = {},
url = {https://www.osti.gov/biblio/196525},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Oct 01 00:00:00 EDT 1995},
month = {Sun Oct 01 00:00:00 EDT 1995}
}