Sustainable Wood-Waste-Based Thermal Insulation Foam for Building Energy Efficiency
Wood is one of the most abundant biomaterials on Earth, which has been used for centuries in construction applications including furniture, roofing, flooring, and cabinetry. However, wood chips—which are a low-quality and plentiful waste byproduct of lumber milling, woodworking, and shipping operations—have low economic value and complicated disposal methods. In this paper, we propose a strategy for wood chip reuse through the fabrication of bio-based building insulation foam. Through a high-temperature chemical treatment delignification process, we introduced additional small pores within the wood chips, effectively lowering their thermal conductivity, and used them in combination with a binding agent to produce a porous insulation foam. The porous insulation foam achieved a low thermal conductivity of 0.038 W/(m·K) and a high compressive strength of 1.1 MPa (70% strain). These characteristics demonstrate that wood waste can be repurposed into an effective building material, addressing challenges in both waste management and sustainable construction.
- Research Organization:
- Inventwood LLC, College Park, MD (United States)
- Sponsoring Organization:
- USDOE; USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Building Technologies Office
- Grant/Contract Number:
- EE0009702
- OSTI ID:
- 1963125
- Alternate ID(s):
- OSTI ID: 1970750
- Journal Information:
- Buildings, Journal Name: Buildings Journal Issue: 4 Vol. 13; ISSN 2075-5309; ISSN BUILCO
- Publisher:
- MDPI AGCopyright Statement
- Country of Publication:
- Switzerland
- Language:
- English
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