Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool

Ke, Xiaolong; Wu, Wei; Li, Kangsen; Yu, Yongheng; Wang, Tianyi; Zhong, Bo; Wang, Zhenzhong; Guo, Jiang; Wang, Chunjin

doi:10.3390/ma15238327

Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool

Journal Article · Wed Nov 23 00:00:00 EST 2022 · Materials

DOI:https://doi.org/10.3390/ma15238327· OSTI ID:1922808

Ke, Xiaolong ^[1]; ^[2]; Li, Kangsen ^[3]; Yu, Yongheng ^[1]; Wang, Tianyi ^[4]; Zhong, Bo ^[5]; Wang, Zhenzhong ^[6]; Guo, Jiang ^[7]; ^[3]

Xiamen Univ. of Technology (China)
Xiamen Univ. of Technology (China); Hong Kong Polytechnic Univ., Kowloon (Hong Kong)
Hong Kong Polytechnic Univ., Kowloon (Hong Kong)
Brookhaven National Lab. (BNL), Upton, NY (United States). National Synchrotron Light Source II (NSLS-II)
Tsinghua Univ., Beijing (China)
Xiamen Univ. (China)
Dalian Univ. of Technology (China)

Tungsten carbide (WC) has the characteristics of high hardness, high strength, corrosion resistance, wear resistance and excellent fracture toughness. Accordingly, it has been commonly used as the material for cutting tools and molds in glass-forming techniques. To obtain ultra-smooth surfaces, fine polishing of WC is indispensable. However, the efficiency of WC polishing is low using the existing polishing methods, and the mechanism behind the polishing process requires further investigation. Specifically, the effect of the binder in WC polishing is not clear since there are different kinds of WC with various weight percentages of the binder. In this paper, we present the findings of a study on the polishing performance of two kinds of WC material, with and without the binder, using a semi-rigid (SR) bonnet polishing tool. A series of experiments were performed on a 6-DOF robotic polishing instrument to investigate the material-removal characteristics, surface integrity and sub-surface damage after polishing. The results demonstrate that the SR bonnet polishing tool successfully reduced the surface roughness of WC with and without the binder to the nanometric level, though the lowest surface roughness was obtained on binder-less WC. No obvious sub-surface damage was observed under SEM inspection, while the processing efficiency was greatly improved owing to the high material removal rate of the tool. Based on our analysis of key polishing parameters and corresponding surface integrities, the effect of the binder on the polishing performance is explained, which offers excellent guidance for WC polishing.

View Accepted Manuscript (DOE)

Research Organization:: Brookhaven National Laboratory (BNL), Upton, NY (United States)

Sponsoring Organization:: Hong Kong Polytechnic University; Natural Science Foundation of Fujian Province of China; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division

Grant/Contract Number:: SC0012704

OSTI ID:: 1922808

Report Number(s):: BNL-223944-2023-JAAM

Journal Information:: Materials, Journal Name: Materials Journal Issue: 23 Vol. 15; ISSN 1996-1944

Publisher:: MDPICopyright Statement

Country of Publication:: United States

Language:: English

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Related Subjects

ultra-precision machining
36 MATERIALS SCIENCE
binder
bonnet polishing
material removal
surface integrity
tungsten carbide

Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool

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