Controlled wetting and spreading of metals on substrates using porous interlayers and related articles
The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.
- Research Organization:
- Michigan State Univ., East Lansing, MI (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FE0031250
- Assignee:
- Board of Trustees of Michigan State University (East Lansing, MI)
- Patent Number(s):
- 11,284,510
- Application Number:
- 16/386,576
- OSTI ID:
- 1892737
- Country of Publication:
- United States
- Language:
- English
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